iPhone 6 to 17 Pro Max
CPU Lifting Heat & Airflow Guide
Professional motherboard repair reference for CPU lifting using Quick 861DW, YCS R1 Pro, and Sugon 8650 hot air stations. Includes temperature ranges, airflow settings, lifting time, and advanced technician precautions.
🔥 Bottom Preheater Temperature
- iPhone 6 / 6 Plus → 150°C – 160°C
- iPhone 6S to X → 160°C – 170°C
- iPhone XS to 11 → 170°C – 180°C
- iPhone 12 to 17 Pro Max → 180°C – 190°C
🛠 Recommended Equipment
- Quick 861DW
- YCS R1 Pro
- Sugon 8650
- PCB Holder
- Microscope
- Bottom Preheater
🌡 CPU Lifting Temperature Table
| Model | Temperature | Airflow | Time |
|---|---|---|---|
| iPhone 6 / 6 Plus | 365°C – 380°C | 25 – 35 | 60 – 90 sec |
| iPhone 7 Series | 380°C – 390°C | 30 – 40 | 90 – 120 sec |
| iPhone X | 390°C – 400°C | 35 – 45 | 110 – 140 sec |
| iPhone 11 Series | 400°C – 410°C | 35 – 50 | 130 – 160 sec |
| iPhone 12 Series | 405°C – 420°C | 40 – 55 | 150 – 190 sec |
| iPhone 13 Series | 410°C – 425°C | 45 – 60 | 170 – 210 sec |
| iPhone 14 Series | 415°C – 430°C | 45 – 60 | 180 – 230 sec |
| iPhone 15 / 16 / 17 Pro Max | 425°C – 440°C | 55 – 70 | 210 – 260 sec |
⚡ Quick 861DW
Stable airflow and fast thermal recovery. Best for iPhone 6 to 13 motherboard repairs.
- Temperature: 385°C – 425°C
- Airflow: 30 – 60
- Use medium nozzle size
🚀 YCS R1 Pro
Excellent for sandwich boards and modern multilayer iPhones.
- Temperature: 400°C – 440°C
- Airflow: 40 – 70
- Maintain constant nozzle distance
🔥 Sugon 8650
Powerful airflow with fast solder melting capability.
- Temperature: 380°C – 435°C
- Airflow: 35 – 65
- Keep nozzle slightly higher
⚠ Important Repair Warnings
- Too much airflow can blow nearby components.
- Excessive temperature may bubble PCB layers.
- Never force CPU lifting.
- Always use bottom heat for modern boards.
- Uneven heating can tear solder pads.
- iPhone 12 and above boards are extremely sensitive.
💡 Professional Technician Notes
Actual lifting temperature depends on nozzle size, room temperature, solder type, underfill strength, and motherboard condition.
Always increase heat gradually and maintain smooth circular airflow motion during CPU removal.
MH TECH — Advanced Board Repair Reference